Hirai Precision Industry Co., Ltd. Ceramic Processing Technology Introduction
Foundation technology advantageous for miniaturization of modules!
Ceramic processing is a processing technology that uses glass-ceramic substrates with a thermal expansion coefficient close to that of silicon. Glass-ceramic substrates can be fired at temperatures below 1000°C, allowing the use of Ag, AgPd, and Au as internal conductors. Additionally, since the dielectric constant is lower than that of alumina substrates, signal delay is also minimized. The thermal expansion coefficient being close to that of silicon makes direct die bonding and flip chip (FC) connections to the substrate easier. 【Features】 - Advantageous for miniaturization of modules - Direct die bonding and flip chip (FC) connections to the substrate are easy *For more details, please refer to the catalog or feel free to contact us.
- Company：平井精密工業
- Price：Other
